Analisis Interfacial Reaction Antara Substrate Cu Dan Solder 96.5sn3.0ag0.5cu (Sac305) Untuk Pengembangan Aplikasi Sem. JST (Jurnal Sains Terapan), [S. l.], v. 7, n. 1, p. 17–24, 2021. DOI: 10.32487/jst.v7i1.1102. Disponível em: http://jurnal.poltekba.ac.id/index.php/jst/article/view/1102. Acesso em: 9 nov. 2026.